1.1 Features
CPU and On-Chip Memory
• ESP32-D0WD-V3 embedded, Xtensa®
dual-core 32-bit LX6 microprocessor, up to 240
MHz
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions
• 16 KB SRAM in RTC
Wi-Fi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 μs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSD and SBC
Peripherals
• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive
touch sensor, ADC, DAC, TWAI® ( compatible
with ISO 11898-1, i.e. CAN Specification 2.0)
Integrated Components on Module
• 40 MHz crystal oscillator
• 8 MB SPI flash
Antenna Options
• On-board dual PCB antennas
Operation Conditions
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating ambient temperature: –40 ~ 85 °C
Certification
• RF certification: See Certificates
• Green certification: REACH/RoHS
Test
• Reliability: HTOL/HTSL/uHAST/TCT/ESD