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CSD96497 Datenblatt (PDF) - Texas Instruments

CSD96497 Datasheet PDF - Texas Instruments
Teilenummer CSD96497
Download  CSD96497 Download
Filegröße   312.53 Kbytes
Page   10 Pages
Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Bauteilbeschribung CSD96497Q5MC Synchronous buck NexFET™ smart power stage

CSD96497 Datasheet (PDF)

Go To PDF Page Download Datenblatt
CSD96497 Datasheet PDF - Texas Instruments

Teilenummer CSD96497
Download  CSD96497 Click to download

Filegröße   312.53 Kbytes
Page   10 Pages
Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Bauteilbeschribung CSD96497Q5MC Synchronous buck NexFET™ smart power stage

CSD96497 Datenblatt (HTML) - Texas Instruments


CSD96497 Produktdetails

1 Features
1• 65-A continuous operating current capability
• Over 93.5% system efficiency at 30 A
• High-frequency operation (up to 1.25 MHz)
• Diode emulation mode with FCCM
• Temperature compensated bi-directional current
sense
• Analog temperature output
• Fault monitoring - OTP, HS OCP, and short circuit
protection
• 3.3-V and 5-V PWM signal compatible
• Tri-state PWM input
• Integrated bootstrap switch
• Optimized dead time for shoot-through protection
• High-density QFN 5-mm × 6-mm Footprint
• Ultra-low-inductance package
• System optimized PCB footprint
• DualCool™ packaging
• RoHS compliant, lead-free terminal plating
• Halogen free

2 Applications
• Multiphase synchronous buck converters
– High-frequency applications
– High-current, low-duty cycle applications
• POL DC-DC converters
• Memory and graphic cards
• Desktop and server VR12.x and VR13.x V-core
synchronous buck converters
• High-current POL for network communications

3 Description
The CSD96497 NexFET™ power stage is a highly
optimized design for use in a high-power, highdensity
synchronous buck converter. This product
integrates the driver IC and power MOSFETs to
complete the power stage switching function. This
combination produces high-current, high-efficiency,
and high-speed switching capability in a small 5-mm
× 6-mm outline package. It also integrates accurate
current sensing and temperature sensing functionality
to simplify system design and improve accuracy. In
addition, the PCB footprint has been optimized to
help reduce design time and simplify the completion
of the overall system design.




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