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CSD95375Q4MT Datenblatt (PDF) - Texas Instruments

CSD95375Q4MT Datasheet PDF - Texas Instruments
Teilenummer CSD95375Q4MT
Download  CSD95375Q4MT Download
Filegröße   480.79 Kbytes
Page   22 Pages
Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Bauteilbeschribung CSD95375Q4M Synchronous Buck NexFET™ Power Stage

CSD95375Q4MT Datasheet (PDF)

Go To PDF Page Download Datenblatt
CSD95375Q4MT Datasheet PDF - Texas Instruments

Teilenummer CSD95375Q4MT
Download  CSD95375Q4MT Click to download

Filegröße   480.79 Kbytes
Page   22 Pages
Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Bauteilbeschribung CSD95375Q4M Synchronous Buck NexFET™ Power Stage

CSD95375Q4MT Datenblatt (HTML) - Texas Instruments


CSD95375Q4MT Produktdetails

1 Features
1• 93% System Efficiency at 15 A
• Max Rated Continuous Current 25 A, Peak 60 A
• High Frequency Operation (up to 2 MHz)
• High Density - SON 3.5 × 4.5-mm Footprint
• Ultra-Low Inductance Package
• System Optimized PCB Footprint
• Ultra-Low Quiescent (ULQ) Current Mode
• 3.3 V and 5 V PWM Signal Compatible
• Diode Emulation Mode with FCCM
• Tri-State PWM Input
• Integrated Bootstrap Diode
• Shoot Through Protection
• RoHS Compliant – Lead-Free Terminal Plating
• Halogen Free

2 Applications
• Ultrabook/Notebook DC/DC Converters
• Multiphase Vcore and DDR Solutions
• Point of Load Synchronous Buck in Networking,
Telecom, and Computing Systems

3 Description
The CSD95375Q4M NexFET™ Power Stage is a
highly optimized design for use in a high power, high
density Synchronous Buck converter. This product
integrates the driver IC and NexFET technology to
complete the power stage switching function. The driver IC has a built-in selectable diode emulation
function that enables DCM operation to improve light
load efficiency. In addition, the driver IC supports
ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state,
quiescent current is reduced to 130 μA, with
immediate response. When SKIP# is held at tri-state,
the current is reduced to 8 μA (typically 20 μs is
required to resume switching). This combination
produces a high current, high efficiency, and high
speed switching device in a small 3.5 × 4.5-mm
outline package. In addition, the PCB footprint has
been optimized to help reduce design time and
simplify the completion of the overall system design.




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