1FEATURES
2• (Typical Values are: VSUPPLY = 2.7V and
C L = 20 pF, Unless Otherwise Specified.)
• Small Signal Bandwidth 40 MHz
• Supply Voltage Range 2.4V to 5V
• Slew Rate 110 V/μs
• Total Supply Current 1.6 mA
• Shutdown Current 59 μA
• Rail-to-Rail Input and Output
• Individual Buffer Enable Pins
• Rapid T on Technology
• Crosstalk Rejection Circuitry
• 8-pin WSON, Pin Access Packaging
• Temperature Range −40°C to 85°C

APPLICATIONS
• 3G Mobile Applications
• WLAN-WiMAX Modules
• TD_SCDMA Multi-Mode MP3 and Camera
• GSM Modules
• Oscillator Modules

DESCRIPTION
The LMV112 is a high speed dual clock buffer
designed for portable communications and accurate
multi-clock systems. The LMV112 integrates two
40 MHz low noise buffers which optimizes application
and out performs large discrete solutions. This device
enables superb system operation between the base
band and the oscillator signal path while eliminating
crosstalk.
Texas Instruments' unique technology and design
deliver accuracy, capacitance and load resistance
while increasing the drive capability of the device.
The low power consumption makes the LMV112
perfect for battery applications.
The robust, independent, and flexible buffers are
designed to provide the customer with the ability to
manage complex clock signals in the latest wireless
applications. The buffers deliver 110 V/μs internal
slew rate with independent shutdown and duty cycle
precision. The patented analog circuit drives
capacitive loads beyond 20 pF. Texas Instruments'
proven biasing technique has 1V centering, rail-to-rail
input/output unity gain, and AC coupled convenient
inputs. These integrated cells save space and require
no external bias resistors. Texas Instruments' rapid
recovery after disable optimizes performance and
current consumption. The LMV112 offers individual
enable pin controls and since there is no internal
ground reference either single or split supply
configurations offer additional system flexibility and
power choices.
The LMV112 is a proven replacement for any discrete
circuitry and simplifies board layout while minimizing
related parasitic components.
The LMV112 is produced in the small WSON
package which offers high quality while minimizing its
use of PCB space. Texas Instruments' advanced
packaging offers direct PCB-IC evaluation via pin
access.