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IMXRT1160AXEC Datenblatt (PDF) - NXP Semiconductors

IMXRT1160AXEC Datasheet PDF - NXP Semiconductors
Teilenummer IMXRT1160AXEC
Download  IMXRT1160AXEC Download
Filegröße   3212.96 Kbytes
Page   130 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung i.MX RT1160 Crossover Processors Data Sheet for Extended Industrial Products

IMXRT1160AXEC Datasheet (PDF)

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IMXRT1160AXEC Datasheet PDF - NXP Semiconductors

Teilenummer IMXRT1160AXEC
Download  IMXRT1160AXEC Click to download

Filegröße   3212.96 Kbytes
Page   130 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung i.MX RT1160 Crossover Processors Data Sheet for Extended Industrial Products

IMXRT1160AXEC Datenblatt (HTML) - NXP Semiconductors


IMXRT1160AXEC Produktdetails

1.1 Features
The i.MX RT1160 processors are based on Arm Cortex®-M7 Core™ Platform, which has the following
features:
• The Arm Cortex-M7 Core Platform:
— 32 KB L1 Instruction Cache and 32 KB L1 Data Cache
— Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-M
Architecture FPv5
— Support the Arm®v7-M Thumb instruction set, defined in the Armv7-M architecture
— Integrated Memory Protection Unit (MPU), up to 16 individual protection regions
— Up to 512 KB I-TCM and D-TCM in total
— Frequency of 500 MHz
— ECC support for both cache and TCM
— Frequency of the core, as per Table 11, "Operating ranges," on page 27.
• The Arm Cortex®-M4 Core platform:
— Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP
— Integrated MPU with 8 individual protection regions
— 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM
— Frequency of 240 MHz
— ECC support for TCM and parity check support for cache
The SoC-level memory system consists of the following additional components:
— Boot ROM (256 KB)
— On-chip RAM (1 MB in total)
– Configurable 512 KB RAM shared with M7 TCM
– 256 KB RAM shared with M4 TCM
– Dedicated 256 KB OCRAM
— Secure always-on RAM (4 KB)
• External memory interfaces:
— 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200
— 8/16-bit SLC NAND FLASH
— SD/eMMC
— SPI NOR/NAND FLASH
— Parallel NOR FLASH with XIP support
— Single/Dual channel Quad SPI FLASH with XIP support
— Hyper RAM/FLASH
— OCT FLASH
— Synchronization mode for all devices
• Timers and PWMs:
— Six General Programmable Timer (GPT) modules
– 4-channel generic 32-bit resolution timer for each
– Each supports standard capture and compare operation
— Two Periodical Interrupt Timer (PIT) modules
– Four timers for each module
– Generic 32-bit resolution timer
– Periodical interrupt generation
— Four Quad Timer (QTimer) modules
– 4-channel generic 16-bit resolution timer for each
– Each supports standard capture and compare operation
– Quadrature decoder integrated
— Four FlexPWMs
– Up to 8 individual PWM channels for each
– 16-bit resolution PWM suitable for Motor Control applications
— Four Quadrature Decoders
— Four Watch Dog (WDOG) modules
Each i.MX RT1160 processor enables the following interfaces to external devices (some of them are
muxed and not available simultaneously):
• Display Interface:
— Parallel RGB LCD interface (eLCDIF)
– Support 8/16/24-bit interface
– Support up to WXGA resolution @60fps
– Support Index color with 256 entry x 24-bit color LUT
— Parallel RGB LCD Interface Version 2 (LCDIFv2)
– Enhanced based on LCDIF version
– Support up to 8 layers of alpha blending
— MIPI Display Serial Interface (MIPI DSI)
– PHY integrated
– 2 data lanes interface with up to 1.5 GHz bit rate clock
— Smart LCD Display with 8080 interface through SEMC
• Audio:
— SPDIF input and output
— Four Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, and
codec/DSP interfaces
— Medium Quality Sound (MQS) interface via GPIO pads
— PDM microphone interface with 4 pairs of inputs
— Asynchronous Sample Rate Converter (ASRC)
• Graphics engine:
— Generic 2D (PXP)
– BitBlit
– Flexible image composition options—alpha, chroma key
– Porter-duff blending
– Image rotation (90, 180, 270)
– Image resize
– Color space conversion
– Multiple pixel format support (RGB, YUV444, YUV422, YUV420, YUV400)
– Standard 2D-DMA operation
— Vector Graphics Processing
– Real-time hardware curve tessellation of lines, quadratic, and cubic Bezier curves
– 16x Line Anti-aliasing
– OpenVG 1.1 support
– Vector Drawing
• Camera Interface:
— Parallel Camera Sensor Interface (CSI)
– Support 24-bit, 16-bit, and 8-bit input
– Barcode binarization and histogram statistics
— MIPI Camera Serial Interface (MIPI CSI)
– PHY integrated
– 2 data lanes interface with up to 1.5 GHz bit rate clock
• Connectivity:
— Two USB 2.0 OTG controllers with integrated PHY interfaces
— Two Ultra Secure Digital Host Controller (uSDHC) interfaces
– eMMC 5.0 compliance with HS400 support up to 400 MB/sec
– SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec
– Support for SDXC (extended capacity)
— One 10M/100M Ethernet controller with support for IEEE1588
— One Gigabit Ethernet controller with support for AVB
— Twelve universal asynchronous receiver/transmitter (UARTs) modules
— Six I2C modules
— Six SPI modules
— Three FlexCAN (with Flexible Data-rate supported) modules
— Two EMV SIM modules
• Analog:
— Two Analog-Digital-Converters (ADC), which supports both differential and single-end inputs
— One Digital-Analog-Converter (DAC)
— Four Analog Comparators (ACMP)
• GPIO and Pin Multiplexing:
— General-purpose input/output (GPIO) modules with interrupt capability
— Input/output multiplexing controller (IOMUXC) to provide centralized pad control
— Two FlexIO modules
— 8 x 8 keypad
The i.MX RT1160 processors integrate advanced power management unit and controllers:
• Full PMIC integration, including on-chip DCDC and LDOs
• Temperature sensor with programmable trim points
• Hardware power management controller (GPC)
The i.MX RT1160 processors support the following system debug:
• Arm CoreSight debug and trace architecture
• Trace Port Interface Unit (TPIU) to support off-chip real-time trace
• Cross Triggering Interface (CTI)
• Support for 5-pin (JTAG) and SWD debug interfaces
Security functions are enabled and accelerated by the following hardware:
• High Assurance Boot (HAB)
• Cryptographic Acceleration and Assurance (CAAM) module:
— Public Key Cryptography Engine (PKHA)
— Symmetric Engines
— Cryptographic Hash Engine
— Random Number Generation (RNG4)
— Four Job Rings for use by processors
— Secure Hardware-Only Cryptographic Key Management
— Encrypted Boot
— Revision control check based on fuse values
— DEK includes IV
— Side channel attack countermeasures
— 64 KB secure RAM
• Inline Encryption Engine (IEE):
— External memory encryption/decryption
— I/O direct encrypted storage and retrieval (Stream Support)
— FlexSPI decryption only
• On-the-Fly AES Decryption (OTFAD):
— AES-128 Counter Mode On-the-Fly Decryption
— Hardware support for unwrapping “key blobs”
— Functionally acts as a slave sub-module to the FlexSPI
• Secure Non-Volatile Storage (SNVS):
— Secure real-time clock (SRTC)
— Zero Master Key (ZMK)
• Secure always-on RAM (4 KB)
• Secure key management and protection
— Physical Unclonable Function (PUF)
— UnDocumented Function (UDF)
— Built-in Manufacturing Protection Hardware
• Secure and trusted access control




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Über NXP Semiconductors


NXP Semiconductors ist ein öffentlich gehandeltes multinationales Unternehmen, das eine breite Palette von Halbleitern und integrierten Schaltungen für verschiedene Anwendungen entwirft und herstellt, einschließlich Automobil-, Industrie-, Kommunikations- und Verbrauchermärkte.

Das Unternehmen wurde 2006 gegründet und hat seinen Hauptsitz in Eindhoven, Niederlande.

NXP bietet ein breites Produktportfolio an, darunter Mikrocontroller, Mikroprozessoren, sichere Authentifizierungs -ICs, ICs, ICs, RF- und Mikrowellenkomponenten sowie Sensorlösungen.

Die Produkte des Unternehmens sind energieeffizient, sicher und zuverlässig und werden in einer Vielzahl von Anwendungen verwendet, einschließlich Automobilsysteme, industrielle Automatisierung und Steuerung, intelligente Häuser und Gebäude sowie angeschlossene Geräte.

NXP widmet sich der Innovation und der Kundenzufriedenheit und setzt sich dafür ein, den Kunden die besten Halbleiterlösungen zur Verfügung zu stellen, um ihre Bedürfnisse zu erfüllen.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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