FEATURES
The resin layer relieves mechanical stress and thermal shock
X8R and X8L types whose operating temperature are up to 150°C are
available
C0G type having excellent stable temperature and DC-bias characteristics
is also available
APPLICATIONS
Fail-safe design in power line
Prevention of ceramic body cracks by board bending
Prevention of solder cracks by thermal shock
Equipment such as mobile devices having a high possibility of drop