0879370600 Datenblatt(PDF) - Molex Electronics Ltd.

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0879370600 Datenblatt (PDF) - Molex Electronics Ltd.

0879370600 Datasheet PDF - Molex Electronics Ltd.


Teilenummer	0879370600

Download	0879370600 Download

Filegröße	194.91 Kbytes

Page	4 Pages

Hersteller	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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Bauteilbeschribung

2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height

0879370600 Datasheet (PDF)

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0879370600 Datasheet PDF - Molex Electronics Ltd.


Teilenummer	0879370600

Download	0879370600 Click to download

Filegröße	194.91 Kbytes

Page	4 Pages

Hersteller	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

Logo

Bauteilbeschribung	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height

0879370600 Datenblatt (HTML) - Molex Electronics Ltd.

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Ähnliche Teilenummer - 0879370600

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0879370106	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370406	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370502	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370800	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
	0879370801	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height

Ähnliche Beschreibung - 0879370600

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0879370406	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370502	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879371601	195Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height
	0877970602	260Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76關m (30關) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
	0879370106	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370801	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
	0879370802	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879371600	195Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
	0879370800	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
	0879371206	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

Über Molex Electronics Ltd.

Molex Electronics Ltd. ist eine Tochtergesellschaft von Koch Industries, Inc. und globaler Hersteller von elektronischen und Glasfaser -Interconnect -Lösungen.

Die Firma wurde 1938 gegründet und hat seinen Hauptsitz in Lisle, Illinois.

Molex bietet eine breite Palette von Interconnect -Produkten, einschließlich Anschlüssen, Kabelbaugruppen, Schalter und anderen passiven Komponenten.

Diese Produkte werden in verschiedenen Branchen verwendet, darunter Automobile, Datenkommunikation, Unterhaltungselektronik, Industriegeräte, Medizinprodukte und Telekommunikation.

Mit Operationen und Einrichtungen in über 40 Ländern ist Molex für seine Innovations- und Technologie -Führung im Markt für Interconnect Solutions bekannt.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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