| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 STMicroelectronics |
TQFP64
|
128Kb / 5P |
64-LEAD THIN QUAD FLAT PACKAGE
Feb-2003 |
 National Semiconductor ... |
MA06A
|
51Kb / 1P |
MOLDED PACKAGE SUPER SOT 6 LEAD
|
 Analog Devices |
BC-148
|
276Kb / 1P |
148-Lead Chip Scale Package Ball Grid Array
|
 Maxim Integrated Produc... |
21-0114B
|
58Kb / 1P |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE)
REV B |
 Analog Devices |
CP-8-9
|
253Kb / 1P |
8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 x 3 mm Body, Very Thin, Dual Lead
|
 ILSI America LLC |
38-BX0F12.5-32.768
|
51Kb / 2P |
2 Lead Metal Package Crystal, 3 mm x 8 mm, 2 mm x 6 mm, 1 mm x 5 mm
|
 M/A-COM Technology Solu... |
MADC-010736
|
579Kb / 6P |
Lead-Free 6 mm Laminate Package
|
|
MAUC-010515
|
1Mb / 8P |
Lead-Free 6 mm Laminate Package
|
|
XP1050-QJ
|
820Kb / 8P |
Lead-Free 6 mm 24-lead QFN Package
|
 STMicroelectronics |
TQFP44
|
95Kb / 5P |
44-LEAD THIN QUAD FLAT PACKAGE
Nov-2004 |