EPC300-LCC4 Datenblatt(PDF)

Bauteilbeschribung


Teilenummer	EPC300-LCC4

Download	EPC300-LCC4 Click to download

Filegröße	134.25 Kbytes

Page	2 Pages

Hersteller	EPC [Espros Photonics corp]

Direct Link	http://www.espros.ch

Logo

Bauteilbeschribung	CSP-housing on LCC-housing carrierboard for part evaluation purpose of the epc3xx family products.

Ähnliche Beschreibung - EPC300-LCC4

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Cirrus Logic	CDB4334	632Kb / 14P	Evaluation Board for CS4334/8/9 Family of Products
Xilinx, Inc	XC3000L	51Kb / 8P	Part of the ZERO family of 3.3 V FPGAs
PHOENIX CONTACT	2735962	58Kb / 3P	Upper part of housing, for COMBICON connection, three-level
	2764975	151Kb / 9P	Date of manufacture and material and part identification embossed on the housing (recyclability)
	2853747	81Kb / 7P	Upper part of housing, for COMBICON connection, double-level
	2869032	69Kb / 4P	Upper part of housing, double-level, for COMBICON connection, housing width: 45 mm
	2906814	55Kb / 3P	Upper part of housing, for COMBICON connection, double-level.
	2907169	85Kb / 6P	Upper part of housing, for COMBICON connection, double-level
	2914880	57Kb / 3P	Upper part of housing, for COMBICON connection, three-level
ELATEC GmbH	HOP2-CBLEL	269Kb / 3P	Panel housing for RFID modules of the TWN4 MultiTech 2 family 11/2023