GENERAL DESCRIPTION
The HI-8200H family are quad analog CMOS switches fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation and maximum switch isolation. High voltage gate drive is entirely created on-chip enabling +/-12V switching range from a single 3.3V or 5V supply. These switches are ideally suited for applications demanding low switch leakage when the power pins are 0V.
They are optimized for use in high temperature avionics applications. The devices are capable of operating at extended temperature ranges of -55°C to 175°C for plastic packages and -55°C to 200°C for the ceramic CERDIP-16 package.
At 25°C and with VDD from 3.0V to 5.5V, the switch resistance (RON) is typically 8 RON is independent of VDD. In a switch ing range of -5V to +5V, the maximum deviation of RON from flat is less than 5%.
These switches conduct equally well in either direction. Power down and Off state leakages are less than 10nA maximum. Charge injection is less than 10pC. Switching times are typically 180ns to the On state and 60ns to the Off state. The on board charge pump allows an On/Off cycle time of 5KHz for all four switches simultaneously before the switching range becomes restricted.
The HI-8200H provides four each normally open switches when the switch control inputs are low. The HI-8201H provides four each normally closed switches when the switch control in puts are low. The HI-8202H provides a combination of two normally closed and two normally open switches.

FEATURES
• Extended Temperature Ranges
   • -55°C to 175°C (plastic packages)
   • -55°C to 200°C (ceramic CERDIP-16 package)
• CMOS analog switches with up to +/-12V switching range from a single 3.3V or 5V supply
• Low RON: 10 max at 25°C
• Robust CMOS Silicon-on-Insulator (SOI) technology
• Switch nodes are open-circuit when chip is powered down
• SOI switch isolation with 1nA typical Off leakage
• ESD protection > 4KV HBM
• Fast switching time with break-before-make
• Low power

APPLICATIONS
• Down-hole drilling and oil exploration
• High temperature avionics
• Data bus isolation
• Sample-and-Hold circuits
• Test Equipment
• Communications Systems