SO8-FL Datenblatt(PDF) - Amkor Technology

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SO8-FL Datenblatt (PDF) - Amkor Technology

SO8-FL Datasheet PDF - Amkor Technology


Teilenummer	SO8-FL

Download	SO8-FL Download

Filegröße	744.46 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Bauteilbeschribung

Interconnect - Cu clips technology for better electrical and thermal

SO8-FL Datasheet (PDF)

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Download Datenblatt

SO8-FL Datasheet PDF - Amkor Technology


Teilenummer	SO8-FL

Download	SO8-FL Click to download

Filegröße	744.46 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	Interconnect - Cu clips technology for better electrical and thermal

SO8-FL Datenblatt (HTML) - Amkor Technology

SO8-FL Datasheet HTML 1Page - Amkor Technology

SO8-FL Datasheet HTML 2Page - Amkor Technology

Ähnliche Teilenummer - SO8-FL

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Amkor Technology	SO8-FL-V01	676Kb / 2P	This package is available in both JEDEC and JEITA package outlines. 02/21

Ähnliche Beschreibung - SO8-FL

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Intel Corporation	PXA270	1Mb / 126P	Electrical, Mechanical, and Thermal Specification
Littelfuse	354	100Kb / 1P	Fuse Blocks and Clips - For 3AG Fuses
Intel Corporation	LUPXA255A0C200	1Mb / 40P	Electrical, Mechanical, and Thermal Specification
	GDPXA255A0E400	1Mb / 40P	Electrical, Mechanical, and Thermal Specification
	LUPXA255A0E400	1Mb / 40P	Intel짰 PXA255 Processor Electrical, Mechanical, and Thermal Specification
	NHPXA270C5C312	1Mb / 126P	Electrical, Mechanical, and Thermal Specification
International Rectifier	IRFB4019PBF	287Kb / 8P	Low QRR for Better THD and Lower EMI
GOOD-ARK Electronics	GDSSF2301B	293Kb / 4P	TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Amkor Technology	SOD323-FL	459Kb / 2P	Interconnect - Cu clips technology for better electrical and thermal
Axiomtek Co., Ltd.	NA560	234Kb / 1P	Smart Fan for better thermal and acoustic performance

Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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