Features:
• Schottky Barrier Chip
• Ideally Suited for Automatic Assembly
• Low Power Loss, High Efficiency
• For Use in Low Voltage Application
• Guard ring Die Construction
• Plastic Case Material has UL Flammability Classification Rating 94F-0
• Green products in compliance the ROHS directive
• This is a Pb − Free device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

Mechanical Data:
• Case: Low Profile Molded plastic
• Terminals: Plated leads solderable per MIL-STD-750, Method 2026 guaranteed
• Polarity: Color band or cathode Notch
• Mounting Position: Any