LA1 pdf, LA1 Bauteilbeschribung, LA1 Datenblatt, LA1 view ::: ALLDATASHEET :::

Teilenummer	LA1

Bauteilbeschribung	Glass passivated device Ideal for surface mouted applications

Filegröße	603.3 Kbytes

Html View	1 2

Hersteller	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

Direct Link	http://www.leiditech.com

Logo

Ähnliche Teilenummer - LA1

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
List of Unclassifed Man...	LA1	72Kb / 2P	High Power Leaded Chip Attenuators
Sensata Technologies, I...	LA10-08-000A	131Kb / 2P	C Y LINDRICAL FRAMELESS LINEAR VOICE COIL ACTUATORS (VCA)
Sensata Technologies, I...	LA10-12-027A	131Kb / 2P	C Y LINDRICAL FRAMELESS LINEAR VOICE COIL ACTUATORS (VCA)
LEM	LA10-PB	24Kb / 2P	Current Transducer LA 03~20-PB
LEM	LA10-PB	183Kb / 3P	Current Transducer

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Gaomi Xinghe Electronic...	A-1	382Kb / 2P	Glass passivated device
Gaomi Xinghe Electronic...	A1	527Kb / 2P	Glass passivated device
Vishay Siliconix	SMBJ5.0A_THRU_188A	95Kb / 5P	Low profile package, Ideal for automated placement, Glass passivated chip junction 10-Dec-12
Marl International Limi...	507-501-2112	434Kb / 5P	Ideal for high vibration applications
Marl International Limi...	669-503-0410	321Kb / 4P	Ideal for marine applications
Sangdest Microelectroni...	DSR1A	162Kb / 5P	Ideal for surface mouted applications
Ohmite Mfg. Co.	RES-60-4TERM	341Kb / 1P	Ideal for current sensing applications
Hi-Sincerity Mocroelect...	HSK07M	198Kb / 4P	Glass passivated device
SHIKUES Electronics	BAV19W	559Kb / 3P	For surface mounted applications, Glass Passivated Chip Junction
SHIKUES Electronics	BAV19WL	427Kb / 3P	For surface mounted applications, Glass Passivated Chip Junction