| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
PANDUIT CORP. |
SICH25-C
|
82Kb / 1P |
Clip around bundle to hold securely in place
|
Laird Tech Smart Techno... |
FPH
|
140Kb / 2P |
Foam-in-place
|
|
SNL70-HXP
|
1Mb / 2P |
Form-In-Place
|
|
SNN60-RXP
|
1Mb / 2P |
SNN60-RXP Form-In-Place
|
|
SNC70-HXP
|
364Kb / 1P |
Form-In-Place
|
|
SNN65-HXP
|
430Kb / 1P |
Form-In-Place
|
Illinois Capacitor, Inc... |
566LBA450M2AC
|
128Kb / 1P |
SNAP-IN / SNAP MOUNT
|
|
566LMB450M2AD
|
131Kb / 1P |
SNAP-IN / SNAP MOUNT
|
|
686LMB400M2AD
|
131Kb / 1P |
SNAP-IN / SNAP MOUNT
|
Samsung semiconductor |
LSC320AN10
|
2Mb / 34P |
The information described in this specification is preliminary and can be changed without prior notice
|
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