KBDDLM32.13 pdf, KBDDLM32.13 Bauteilbeschribung, KBDDLM32.13 Datenblatt, KBDDLM32.13 view ::: ALLDATASHEET :::

Teilenummer	KBDDLM32.13

Bauteilbeschribung	SYNIOS® S2222 , A centralized chip allows an easy integration into optical systems.

Filegröße	1838.47 Kbytes

Html View	1 2 3 4 5 6 7 8 9 Next

Hersteller	OSRAM [OSRAM GmbH]

Direct Link	http://www.osram.com

Logo

Ähnliche Teilenummer - KBDDLM32.13

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
ams AG	KBDDLM31.13	1Mb / 21P	This square package with just 2mm outline combines best performance with a small footprint. Version 1.3 2020-07-17
OSRAM GmbH	KBDDLM31.13	1Mb / 21P	This square package with just 2mm outline combines best performance with a small footprint. Version 1.3 2020-07-17
ams AG	KBDDLM31.13-6D7E-25-24A4	1Mb / 21P	This square package with just 2mm outline combines best performance with a small footprint. Version 1.3 2020-07-17
OSRAM GmbH	KBDDLM31.13-6D7E-25-24A4	1Mb / 21P	This square package with just 2mm outline combines best performance with a small footprint. Version 1.3 2020-07-17

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
STMicroelectronics	UM1551	684Kb / 17P	This demonstration board allows the easy measurement 10-Jun-2013
List of Unclassifed Man...	SHT7X	286Kb / 12P	Pin type package ??easy integration
List of Unclassifed Man...	GP-1450	505Kb / 2P	PEN film reinforcement allows easy
Taoglas antenna solutio...	CBD02.07.0100C	6Mb / 20P	Flexible for easy integration
Lumileds Lighting Compa...	LXS0-PR00-0017N	2Mb / 20P	Best punch and easy integration
Lumileds Lighting Compa...	DS113	2Mb / 20P	Best punch and easy integration
PHOENIX CONTACT	1836803	101Kb / 3P	Designed for integration into the SMT soldering process
	1836845	100Kb / 3P	Designed for integration into the SMT soldering process
	1836984	91Kb / 3P	Designed for integration into the SMT soldering process
Maxim Integrated Produc...	MAX3795EVKIT	343Kb / 6P	Allows Optical and Electrical Evaluation Rev 0, 11/04