MO-192 pdf, MO-192 Bauteilbeschribung, MO-192 Datenblatt, MO-192 view ::: ALLDATASHEET :::

Teilenummer	MO-192

Bauteilbeschribung	The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

Filegröße	728.44 Kbytes

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Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Ähnliche Beschreibung - MO-192

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Yamaichi Electronics Co...	IC280-169-127	263Kb / 5P	Ball Grid Array (FBGA / CSP / LGA)
Abracon Corporation	ASCSM	1Mb / 3P	Ball Grid Array Packaging 04.24.14
Microchip Technology	ATTINY1624	3Mb / 522P	tinyAVR® 2 Family Rev.A - 07/2020
Nuvoton Technology Corp...	M2354	4Mb / 234P	NuMicro® Family Arm® 32-bit Cortex®-M23 Microcontroller Rev. 1.01
Cree, Inc	XMLAWT-00-0000-0000U2051	1Mb / 22P	Cree® XLamp® XM Family LEDs 2010-2016
Nuvoton Technology Corp...	M0A21	8Mb / 212P	NuMicro® Family Arm® Cortex®-M0-based Microcontroller Rev 1.02
	M480	12Mb / 525P	NuMicro® Family Arm® 32-bit Cortex®-M4 Microcontroller Rev 3.03
	M254	8Mb / 256P	NuMicro® Family Arm® 32-bit Cortex®-M23 Microcontroller Rev 1.01 / Nov. 12, 2021
Microchip Technology	AVR32	9Mb / 603P	AVR® DD Family Rev. A - 05/2022
Microchip Technology	AVR32DD20T	9Mb / 603P	AVR® DD Family