TSON8-FL-V01 pdf, TSON8-FL-V01 Bauteilbeschribung, TSON8-FL-V01 Datenblatt, TSON8-FL-V01 view ::: ALLDATASHEET :::

Teilenummer	TSON8-FL-V01

Bauteilbeschribung	TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package

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Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Ähnliche Beschreibung - TSON8-FL-V01

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
STMicroelectronics	TQFP64	128Kb / 5P	64-LEAD THIN QUAD FLAT PACKAGE Feb-2003
ON Semiconductor	NTMFS4701N	90Kb / 5P	Power MOSFET 30 V, 20 A, Single N-Channel, SOIC-8 Flat Lead Package July, 2007 - Rev. 3
STMicroelectronics	STL11N4LLF5	1Mb / 14P	N-channel 40 V, 9.1 m typ., 15 A STripFETV Power MOSFET in a PowerFLAT 3.3 x 3.3 package 19-Feb-2013
	STL11N3LLH6	1Mb / 14P	N-channel 30 V, 0.006 typ., 11 A STripFET VI DeepGATE Power MOSFET in a PowerFLAT 3.3 x 3.3 package 23-May-2013
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Vishay Siliconix	IL211AT	141Kb / 7P	Optocoupler, Phototransistor Output, with Base Connection in SOIC-8 Package 21-Dec-10
ECS, Inc.	ECX-64	545Kb / 2P	The ECX-64 is a miniature SMD Crystal with a 6 x 3.5 mm 4 pad footprint
Texas Instruments	TPS746	1Mb / 22P	1-A LDO With Power-Good in a Small 2-mm x 2-mm WSON Package
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