| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
0740296000
|
309Kb / 6P |
2.00mm (.079) Pitch VHDM짰 Board-to-Board Backplane Receptacle Power Module, Vertical, 6-Row, 2 Circuits, Gold (Au) Selective 0.76關m (30關)
|
|
0736561000
|
414Kb / 7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736565001
|
403Kb / 7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736560000
|
355Kb / 6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736590002
|
112Kb / 3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關
|
|
0736590001
|
112Kb / 3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736562001
|
409Kb / 7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736560190
|
116Kb / 3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736560180
|
399Kb / 7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76關m (30關")
|
|
0736590003
|
112Kb / 3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關")
|
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