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0877970010 Datenblatt (PDF) - Molex Electronics Ltd.

Teilenummer	0877970010

Bauteilbeschribung	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

Filegröße	125.32 Kbytes

Html View	1 2 3

Hersteller	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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0877970010 Datenblatt (PDF) - Molex Electronics Ltd.

Ähnliche Teilenummer - 0877970010

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0877970040	196Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height

Ähnliche Beschreibung - 0877970010

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0877971800	259Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
	0879140807	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging
	0879143416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879143216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879144416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140806	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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