| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
M/A-COM Technology Solu... |
S2080
|
45Kb / 2P |
Moisture Effects on the Soldering of Plastic Encapsulated Devices
|
Shoulder Electronics Li... |
HDF860ES4
|
169Kb / 8P |
The tape shall be wound around the reel in the direction shown below
|
|
HDF866AS6
|
169Kb / 8P |
The tape shall be wound around the reel in the direction shown below
|
|
HDF915ANS6
|
178Kb / 8P |
The tape shall be wound around the reel in the direction shown below
|
Astec America, Inc |
AEE
|
175Kb / 2P |
Encapsulated
|
Artesyn Technologies |
ASA
|
701Kb / 3P |
Encapsulated
|
TT Electronics. |
HM31
|
1Mb / 1P |
Encapsulated Encapsulated Encapsulated Current Sense Transformers
|
PHOENIX CONTACT |
2322676
|
72Kb / 5P |
Encapsulated socket strips on the module side
|
Banner Engineering Corp... |
WLA
|
383Kb / 4P |
WLA Series Encapsulated Work Light
|
Littelfuse |
DO-35
|
386Kb / 5P |
Standard Series Glass Encapsulated Thermistors
|
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