| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 NXP Semiconductors |
SOT117-1
|
9Kb / 1P |
DIP28: plastic dual in-line package; 28 leads (600 mil)
2003 Feb 18 |
 Continental Device Indi... |
WOM
|
57Kb / 3P |
WOM 4-Leads Leaded Plastic Package
|
|
TO-92L
|
320Kb / 5P |
TO-92L (3 Leads) Leaded Plastic Package
|
|
KBU
|
144Kb / 3P |
KBU (4 Leads) In-line Leaded Package
|
|
KBPC
|
148Kb / 3P |
KBPC (4 Leads) Square Leaded Package
|
|
KBP4
|
122Kb / 3P |
KBP 4 Leads (In-line) Leaded Package
|
|
KBL
|
149Kb / 3P |
KBL (4 Leads) In-line Leaded Package
|
|
ITO-220AC
|
412Kb / 6P |
ITO-220AC (2 Leads) Isolated Leaded Plastic Package
|
|
GBJ4
|
80Kb / 3P |
GBJ 4 Leads (In-line) Leaded Package
|
 Foshan Blue Rocket Elec... |
BRGBU2502SF
|
607Kb / 6P |
Ultrafast Recovery rectifier bridge in a GBU Plastic Package.
|