ML7125-002 pdf, ML7125-002 Bauteilbeschribung, ML7125-002 Datenblatt, ML7125-002 view ::: ALLDATASHEET :::

Teilenummer	ML7125-002

Bauteilbeschribung	Bluetooth Smart LSI supporting Core Specification

Filegröße	1253.49 Kbytes

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Hersteller	LAPIS [LAPIS Semiconductor Co., Ltd.]

Direct Link	http://www.lapis-semi.com/

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Ähnliche Beschreibung - ML7125-002

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
List of Unclassifed Man...	BT111	1Mb / 54P	Bluetooth Smart Ready HCI Module
List of Unclassifed Man...	WT32	147Kb / 3P	Bluetooth specification
DB Lectro Inc	BCD210	375Kb / 2P	Bluetooth v2.0 EDR specification
Abracon Corporation	ABBTM-NVC-MDCS71-MESH	9Mb / 9P	Low Power Bluetooth Module (supporting CSRmesh) 06.29.15
LAPIS Semiconductor Co....	MK71251-01	1Mb / 29P	Bluetooth Smart wireless module
Cypress Semiconductor	BCM20707	1Mb / 65P	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
Silicon Laboratories	BT121	2Mb / 48P	Bluetooth Smart Ready Module
List of Unclassifed Man...	NRF5340	362Kb / 2P	Dual processor SoC supporting Bluetooth 5.1, Bluetooth mesh, NFC, Thread & Zigbee
Dialog Semiconductor	DA14580	96Kb / 4P	Bluetooth Smart changed to Bluetooth low energy as per Bluetooth SIG directive.
Nordic Semiconductor	NRF5340-DK	973Kb / 2P	Development kit for the nRF5340, a dual-core Bluetooth 5.2 SoC supporting Bluetooth Low Energy, Bluetooth mesh, NFC, Thread and Zigbee Version 1.0