| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Micro Electronics |
MS61D
|
57Kb / 1P |
SOLID STATE INDICATORS ARE ENCAPSULATED IN RECTANGULAR EPOXY PACKAGE
|
|
MSB62D
|
56Kb / 1P |
SOLID STATE INDICATORS ARE ENCAPSULATED IN RECTANGULAR EPOXY PACKAGE
|
NEC |
FB1A4M
|
111Kb / 8P |
COMPOUND TRANSISTOR
|
|
HQ1F3P
|
111Kb / 6P |
COMPOUND TRANSISTOR
|
Clairex Technologies, I... |
CL9P5LQ
|
100Kb / 1P |
Epoxy-encapsulated Photoconductors
|
Sumida Corporation |
CDMC80D50AA
|
221Kb / 4P |
Metal compound molding type construction
|
|
CDMC8D28
|
144Kb / 4P |
Metal compound molding type construction.
|
Banner Engineering Corp... |
T18-2
|
694Kb / 10P |
Epoxy Encapsulated Right-Angle Sensor
|
3M Electronics |
DP270
|
225Kb / 8P |
Scotch-WeldTM Epoxy Potting Compound/Adhesive
|
List of Unclassifed Man... |
832WC
|
170Kb / 8P |
Optically Clear Epoxy, Encapsulating & Potting Compound
07 February 2020 |
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