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STTH1R06RL Datenblatt(PDF) 5 Page - STMicroelectronics |
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STTH1R06RL Datenblatt(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() STTH1R06 5/9 Figure 13: Junction capacitance versus reverse voltage applied (typical values) Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35µm) (DO-41, SMB) Figure 15: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35µm) (SMA) 1 10 100 1 10 100 1000 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC j 0 10 20 30 40 50 60 70 80 90 100 110 01234 56789 10 R (°C/W) th(j-a) S(cm²) DO-41 Lleads = 10mm SMB 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S(cm²) SMA |
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