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ATPL360 Datenblatt(PDF) 2 Page - Microchip Technology

Teilenummer ATPL360
Bauteilbeschribung  Multi-Protocol Modem for Power Line Communication
PDF  2 Pages
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Hersteller  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

ATPL360 Datenblatt(HTML) 2 Page - Microchip Technology

  ATPL360 Datasheet HTML 1Page - Microchip Technology ATPL360 Datasheet HTML 2Page - Microchip Technology  
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The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective
companies. © 2017, Microchip Technology Incorporated. All Rights Reserved. 8/17
DS00002296B
www.microchip.com/smartenergy
ATPL360 Evaluation Kit (ATPL360-EK)
Microchip’s ATPL360 Evaluation Kit is a hardware platform for evaluating the ATPL360 multi-protocol modem for power line
communication. The kit will provide easy access to the features of the ATPL360, and will include a ATSAM4CMS System-on-Chip
with embedded metrology. This kit makes it easy to evaluate Microchip’s platform concept for smart energy applications. The kit
includes:
• Two ATPL360MB modem boards
• Two coupling boards to configure the evaluation kit for frequencies below 100 kHz (CENELEC profile)
• Two coupling boards to configure the evaluation kit for frequencies above 150 kHz (FCC and ARIB profiles)
• Documentation for PLC hardware design
• Schematics, PCB layout, gerbers and BOM
• ATPL360 datasheet
• Application notes for PLC hardware design
• PLC software (G3-PLC and PRIME)
• Examples showing how to use and configure the PHY layer on the ATPL360
• Complete G3-PLC and PRIME software stack to implement an end device
• PAN coordinator/base node “lite” example application
• Software documentation
• Microchip tools for PLC developers: PC applications to evaluate the performance of the ATPL360 and network level
(PHY tester, Multi-protocol sniffer)
For more information, please email PLC@microchip.com.



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