SPBTLE-1S

Hardware design

DocID030445 Rev 3

17/27

(http://www.st.com/en/wireless-connectivity/bluenrg-1.html )

5.3

Reflow soldering

The SPBTLE-1S is a high temperature strength surface mount Bluetooth® module supplied

on a 23 pin, 4-layer PCB.

Module is assembled with special soldering paste that allow to make the additional reflow

with no changes in the module original characteristic. It’s important to respect the

parameter listed in the follow table.

The final assembly recommended reflow profiles are indicated here below.

Soldering phase has to be executed with care: in order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on following

recommendations.

Table 8: Soldering

Profile feature

Pb-free assembly

3 °C / sec max

Preheat

150 °C

200 °C

60 - 100 sec

Time maintained above

217 °C

60 - 70 sec

240 + 0 °C

10 - 20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max

Figure 11: Soldering profiles