TLC080AIP datasheet(22/52 Pages) TI

22 / 52 page

TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA

FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY

OPERATIONAL AMPLIFIERS

SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004

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APPLICATION INFORMATION

general PowerPAD design considerations

The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are

constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This

arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see

Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance

can be achieved by providing a good thermal path away from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with the, heretofore, awkward mechanical methods of heatsinking.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE B: The thermal pad is electrically isolated from all terminals in the package.

Figure 52. Views of Thermally Enhanced DGN Package

Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the

recommended approach.

68 mils x 70 mils with 5 vias

(Via diameter = 13 mils)

78 mils x 94 mils with 9 vias

(Via diameter = 13 mils)

Thermal Pad Area

Single or Dual

Quad

Figure 53. PowerPAD PCB Etch and Via Pattern

TLC080AIP Datenblatt(PDF) 22 Page - Texas Instruments