HCS370TP datasheet(23/36 Pages) MICROCHIP

23 / 36 page

2002 Microchip Technology Inc.

Preliminary

DS41111D-page 23

HCS370

9.0

ELECTRICAL CHARACTERISTICS

9.1

Maximum Ratings*

Ambient temperature under bias............................................................................................................. -40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD w/respect to VSS ................................................................................................................ -0.3 to +7.5V

Voltage on LED w/respect to VSS ..................................................................................................................-0.3 to +11V

Voltage on all other pins w/respect to VSS ........................................................................................-0.3V to VDD + 0.3V

Total power dissipation (Note 1) .......................................................................................................................... 500 mW

Maximum current out of VSS pin ...........................................................................................................................100 mA

Maximum current into VDD pin .............................................................................................................................. 100 mA

Input clamp current, IIK (VI < 0 or VI > VDD) ......................................................................................................... ± 20 mA

Output clamp current, IOK (Vo < 0 or Vo >VDD).................................................................................................... ± 20 mA

Maximum output current sunk by any Output pin.................................................................................................... 25 mA

Maximum output current sourced by any Output pin .............................................................................................. 25 mA

*Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

Note 1: Power dissipation is calculated as follows: Pdis=VDD x {IDD - Â IOH} + Â {(VDD-VOH) x IOH} + Â(VOl x IOL).

HCS370TP Datenblatt(PDF) 23 Page - Microchip Technology

HCS370TP Datenblatt(HTML) 23 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

Datenblatt Download

Link URL