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MP157 Datenblatt(PDF) 4 Page - Monolithic Power Systems

Teilenummer MP157
Bauteilbeschribung  Smallest Energy Efficient Off-line Regulator with Extended Power Range
PDF  20 Pages
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Hersteller  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP157 Datenblatt(HTML) 4 Page - Monolithic Power Systems

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MP157 –SMALLEST ENERGY EFFICIENT OFF-LINE REGULATOR WITH EXTENDED POWER RANGE
MP157 Rev. 1.04
www.MonolithicPower.com
4
6/27/2016
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2016 MPS. All Rights Reserved.
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
1
2
3
5
4 SOURCE
SOURCE
VCC
FB
DRAIN
VCC
FB
SOURCE
SOURCE
N/C
DRAIN
N/C
N/C
1
2
3
4
8
7
6
5
TSOT23-5
SOIC-8
ABSOLUTE MAXIMUM RATINGS (1)
Drain to SOURCE .........................-0.3V to 500V
All the other Pin .............................-0.3V to 6.5V
Continuous Power Dissipation (TA = +25°C)
(2)
TSOT23-5 ..................................................... 1W
SOIC8 ........................................................... 1W
Junction Temperature...............................150
C
Lead Temperature ....................................260
C
Storage Temperature............... -60
C to +150C
ESD Capability Human Body Mode .......... 2.0kV
ESD Capability Machine Mode .................. 200V
Recommended Operating Conditions
(3)
Operating Junction Temp. (TJ). -40°C to +125°C
Operating VCC range ...................4.45V to 4.6V
Thermal Resistance
(4)
θJA
θJC
TSOT23-5.............................. 100 ..... 55... °C/W
SOIC-8.................................... 96 ...... 45... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.



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