LTM4644 datasheet(2/32 Pages) LINER

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LTM4634

4634f

For more information www.linear.com/LTM4634

pin conFiguraTion

absoluTe MaxiMuM raTings

CNTL_PWR ............................................... –0.3V to 30V

VIN1, VIN2, VIN3........................................... –0.3V to 30V

VOUT1, VOUT2........................................... –0.3V to 5.75V

VOUT3......................................................... –0.3V to 14V

Switch Voltage (SW1, SW2 and SW3) ...........–1V to 30V

MODE/PLLIN, TK/SS1, TK/SS2, TK/SS3,

FREQ/PLLLPF .......................................–0.3V to INTVCC

COMP1, COMP2, COMP3, VFB1, VFB2, VFB3

(Note 3).................................................–0.3V to INTVCC

RUN1, RUN2, RUN3, INTVCC, EXTVCC,

PGOOD12, PGOOD3..................................... –0.3V to 6V

TEMP1, TEMP2......................................... –0.3V to 0.8V

INTVCC Peak Output Current................................100mA

Operating Junction Temperature Range

(Note 2).................................................. –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature ................. 245°C

(Note 1)

SW3

TEMP2

GND

TKSS2

TK/SS1

TK/SS3

VFB3

VFB2

VFB1

FREQ/PLLLPF

SGND

VIN1

SW1

SW2

VIN2

VIN3

VOUT3

TOP VIEW

BGA PACKAGE 144 LEAD (15mm

× 15mm × 5.01mm)

VOUT2

VOUT1

GND

COMP3

COMP2

COMP1

PGOOD12

PGOOD3

EXTVCC

GND

10 11 12

TEMP1

INTVCC

CNTL_PWR

MODE/PLLIN

RUN1

RUN2

RUN3

TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 4°C/W, θJCtop = 5°C/W

θJA DERIVED FROM 95mm × 76mm PCB WITH 4-LAYER, WEIGHT = 3.2g

θ VALUES DETERMINED PER JESD51-12

orDer inForMaTion

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(See Note 2)

DEVICE

FINISH CODE

LTM4634EY#PBF

SAC305 (RoHS)

LTM4634Y

BGA

–40°C to 125°C

LTM4634IY#PBF

SAC305 (RoHS)

LTM4634Y

BGA

–40°C to 125°C

LTM4634IY

SnPb (63/37)

LTM4634Y

BGA

–40°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Markings:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

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