LTM8056 datasheet(20/28 Pages) LINER

20 / 28 page

LTM8056

8056fa

For more information www.linear.com/LTM8056

A graphical representation of these thermal resistances

is given in Figure 7.

The blue resistances are contained within the µModule

converter, and the green are outside.

The die temperature of the LTM8056 must be lower than

the maximum rating of 125°C, so care should be taken in

the layout of the circuit to ensure good heat sinking of the

LTM8056. The bulk of the heat flow out of the LTM8056

is through the bottom of the μModule converter and the

BGA pads into the printed circuit board. Consequently a

poor printed circuit board design can cause excessive

heating, resulting in impaired performance or reliability.

Please refer to the PCB Layout section for printed circuit

board design suggestions.

8056 F07

µMODULE CONVERTER

JUNCTION-TO-CASE (TOP)

RESISTANCE

JUNCTION-TO-BOARD RESISTANCE

JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)

CASE (TOP)-TO-AMBIENT

RESISTANCE

BOARD-TO-AMBIENT

RESISTANCE

JUNCTION-TO-CASE

(BOTTOM) RESISTANCE

JUNCTION

AMBIENT

CASE (BOTTOM)-TO-BOARD

RESISTANCE

Figure 7

APPLICATIONS INFORMATION

LTM8056 Datenblatt(PDF) 20 Page - Linear Technology