ISL34340 datasheet(3/11 Pages) RENESAS

3 / 11 page

ISL34340

FN6255 Rev 1.00

Page 3 of 11

Jun 23, 2008

Absolute Maximum Ratings

Thermal Information

Supply Voltage

VDD_P to GND_P, VDD_TX to GND_TX,

VDD_IO to GND_IO . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.6V

VDD_CDR to GND_CDR, VDD_CR to GND_CR . . -0.5V to 2.5V

Between any pair of GND_P, GND_TX,

GND_IO, GND_CDR, GND_CR . . . . . . . . . . . . . -0.1V to 0.1V

3.3V Tolerant LVTTL/LVCMOS Input Voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V

Differential Input Voltage . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V

Differential Output Current . . . . . . . . . . . . . .Short Circuit Protected

LVTTL/LVCMOS Outputs . . . . . . . . . . . . . . . .Short Circuit Protected

ESD Rating

Human Body Model

All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4kV

SERIOP/N (all VDD Connected, all GND Connected) . . . . .8kV

Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200V

Thermal Resistance (Typical, Notes 1, 2)

JA

JC (°C/W)

EPTQFP. . . . . . . . . . . . . . . . . . . . . . . .

4.5

Maximum Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 327mW

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C

Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C

Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

2. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications

Unless otherwise indicated, all data is for:

VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,

VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16k, High-speed AC-coupling

capacitor = 27nF.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY VOLTAGE

VDD_CDR, VDD_CR

1.7

1.8

1.9

VDD_TX, VDD_P, VDD_AN, VDD_IO

3.0

3.3

3.6

SERIALIZER POWER SUPPLY CURRENTS

Analog TX Supply Current

IDDTX

VIDEO_TX = 1

PCLK_IN = 40MHz

Analog CDR Supply Current

IDDCDR

Digital I/O Supply Current

IDDIO

Digital Supply Current

IDDCR

PLL/VCO Supply Current

IDDP

Analog Bias Supply Current

IDDAN

5.5

Total 1.8V Supply Current

Total 3.3V Supply Current

DESERIALIZER POWER SUPPLY CURRENTS

Analog TX Supply Current

IDDTX

VIDEO_TX = 0

REF_CLK = 40MHz

Analog CDR Supply Current

IDDCDR

Digital I/O Supply Current

IDDIO

Digital Supply Current

IDDCR

PLL/VCO Supply Current

IDDP

Analog Bias Supply Current

IDDAN

5.4

Total 1.8V Supply Current

Total 3.3V Supply Current

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