© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN7382 Rev. 1.0.8

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only.

Notes:

2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).

3. Refer to the following standards:

JESD51-2: Integral circuits thermal test method environmental conditions - natural convection

JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages

Recommended Operating Ratings

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Characteristics

Min.

Max.

Unit

High-side offset voltage

V

High-side floating supply voltage

-0.3

625

High-side floating output voltage HO

Low-side and logic fixed supply voltage

-0.3

25

Low-side output voltage LO

-0.3

Logic input voltage (HIN, LIN)

-0.3

COM

Logic ground

Allowable offset voltage slew rate

50

V/ns

(2)(3)(4)

Power dissipation

8-SOP

0.625

W

14-SOP

1.0

8-DIP

1.2

θ

JA

Thermal resistance, junction-to-ambient

8-SOP

200

°C/W

14-SOP

110

8-DIP

100

Junction temperature

150

°C

Storage temperature

150

°C

Symbol

Parameter

Min.

Max.

Unit

High-side floating supply voltage

V

High-side floating supply offset voltage

600

High-side (HO) output voltage

Low-side (LO) output voltage

COM

Logic input voltage (HIN, LIN)

COM

Low-side supply voltage

10

20

Ambient temperature

-40

125

°C