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K4S643233F Datenblatt(PDF) 4 Page - Samsung semiconductor

Teilenummer K4S643233F
Bauteilbeschribung  2Mx32 Mobile SDRAM 90FBGA CMOS SDRAM
PDF  8 Pages
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Hersteller  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4S643233F Datenblatt(HTML) 4 Page - Samsung semiconductor

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K4S643233F-S(D)E/N/I/P
Rev. 1.5 Dec. 2002
CMOS SDRAM
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25
°C to 85°C for Extended, -40°C to 85°C for Industrial)
Notes :
1. VIH (max) = 5.3V AC. The overshoot voltage duration is
≤ 3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is
≤ 3ns.
3. Any input 0V
≤ VIN ≤ VDDQ.
Input leakage currents include HI-Z output leakage for all bi-directional buffers with Tri-State outputs.
4. Dout is disabled, 0V
≤ VOUT ≤ VDDQ.
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
VDD
2.7
3.0
3.6
V
VDDQ
2.7
3.0
3.6
V
Input logic high voltage
VIH
2.2
3.0
VDDQ+0.3
V
1
Input logic low voltage
VIL
-0.3
0
0.5
V
2
Output logic high voltage
VOH
2.4
-
-
V
IOH = -2mA
Output logic low voltage
VOL
-
-
0.4
V
IOL = 2mA
Input leakage current
ILI
-10
-
10
uA
3
ABSOLUTE MAXIMUM RATINGS
Notes :
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
Parameter
Symbol
Value
Unit
Voltage on any pin relative to Vss
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on V DD supply relative to Vss
VDD , VDDQ
-1.0 ~ 4.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
1
W
Short circuit current
IOS
50
mA
CAPACITANCE (VDD = 3.0V & 3.3, TA = 23
°C, f = 1MHz, VREF =0.9V ± 50 mV)
Pin
Symbol
Min
Max
Unit
Note
Clock
CCLK
-
4.0
pF
RAS, CAS, WE, CS, CKE, DQM0~ DQM3
CIN
-
4.0
pF
Address(A0 ~ A10, BA0 ~ BA1)
CADD
-
4.0
pF
DQ0 ~ DQ31
COUT
-
6.0
pF



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