© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSUSB31 Rev. 1.1.0

13

Figure 24. 8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm

For MicroPak™ tape and reel specifications, please visit Fairchild’s website:

http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

1.20

1.4

5

2

0.35

0.25

7X

(0.2)

0.15

0.25

SEATING

PLANE

0.40

0.10

C A B

0.05

C

2X

2X

0.025

0.00

C

0.10

A

C

0.10

A. DOES NOT CONFORMS TO JEDEC STANDARD.

C

0.05

B

C

0.05

PIN#1 IDENT

0.55 MAX

C

BOTTOM VIEW

TOP VIEW

8

1

6

4

NOTES:

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES CONFORMS TO ASME Y14.5M, 1994.

D. DRAWING FILE NAME : UMLP08Arev1

8X

DETAIL A

DETAIL: A

SCALE : 2x

0.30

0.20

0.10

45°

0.10

0.400

0.250 8X

0.350 7X

0.450

1.250

0.625

1.450

0.725