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CPC7524 Datenblatt(PDF) 13 Page - IXYS Corporation |
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CPC7524 Datenblatt(HTML) 13 Page - IXYS Corporation |
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13 / 15 page ![]() INTEGRATED CIRCUITS DIVISION CPC7524 R02 www.ixysic.com 13 higher switch current and/or higher ambient operating temperatures will need to consider the thermal performance. Being a real physical device the CPC7524 has a finite thermal capability that when properly considered will ensure appropriate behavior and performance. Determination of the thermal constraint is easily accomplished using the following power equations: and Where PVDD is the dissipated power drawn from the VDD supply and PSW is the power dissipated by the active switches. The VDD power can be calculated from the “VDD Voltage Supply Specifications” on page 7 while the power dissipated by the switches is the sum of the concurrent active switches. Total switch power is the sum of the maximum current through each active switch times the On-Resistance of the switch (ISWx 2 XR ON). The second equation is used to calculate the maximum ambient temperature that the device can be operated in based on the calculated total power of the previous equation. PTOTAL, the value obtained in the first equation; T, the junction temperature rise of the CPC7524 from ambient; and JA, the thermal impedance of the device package are used to determine the maximum operating ambient temperature. Using the junction temperature rise equation T=T J -TA; the thermal impedance JA =70C/W; and a maximum junction temperature TJ-MAX = 110C, the equation reduces to: To avoid entering thermal shutdown, the value for the maximum junction temperature was set to 110 C. Conversely, it is possible to rework the equations to determine the maximum switch current for a maximum ambient current. When using the individual switches of the CPC7524 within their allowable operating region, no restrictions are placed on any other switch. P TOTAL P V DD P SW + = P TOTAL T JA --------- = T AMAX – T JMAX – P TOTAL JA – = |
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