TLSH157P

2002-09-25

2

Precaution

Please be careful of the followings

· Soldering temperature: 260°C max

Soldering time: 3s max

(Soldering portion of lead: Up to 2 mm from the body of the device)

· If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to

the resin. Soldering should be performed after lead forming.

· This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure

that it will not be affected by this IR light.