LTC6242IGN datasheet(22/24 Pages) LINER

Teilenummer	LTC6242IGN

Bauteilbeschribung	Dual/Quad 18MHz, Low Noise, Rail-to-Rail, CMOS Op Amps

PDF	24 Pages

Scroll/Zoom	100%

Hersteller	LINER [Linear Technology]

Direct Link	http://www.linear.com

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22 / 24 page

LTC6241/LTC6242

62412f

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698)

PACKAGE DESCRIPTIO

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 1203

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

LTC6242IGN Datenblatt(PDF) 22 Page - Linear Technology

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