Data Sheet

SSM2305

Rev. B | Page 5 of 16

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

NOTES:

1. NC = NO CONNECT.

2. EXPOSED PAD IS NOT CONNECTED INTERNALLY.

FOR INCREASED RELIABILITY OF THE SOLDER

JOINTS AND MAXIMUM THERMAL CAPABILITY IT

IS RECOMMENDED THAT THE PAD BE SOLDERED

TO THE GROUND PLANE.

SD

NC

IN+

IN–

GND

OUT–

VDD

OUT+

3

4

1

2

6

5

8

7

SSM2305

TOP VIEW

(Not to Scale)

Figure 2. LFSCP Pin Configuration

OUT–

8

GND

7

VDD

6

OUT+

5

SSM2305

TOP VIEW

(Not to Scale)

NC = NO CONNECT

Figure 3. MSOP Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

LFCSP

MSOP

1

1

SD

Shutdown Input. Active low digital input.

2

2

NC

No Connect. This pin has no function; tie it to GND.

3

3

IN+

Noninverting Input.

4

4

IN−

Inverting Input.

5

5

OUT+

Noninverting Output.

6

6

VDD

Power Supply.

7

7

GND

Ground.

8

8

OUT−

Inverting Output.

0

EPAD

Exposed Pad. The exposed pad is not connected internally. For increased reliability of the solder joints and

maximum thermal capability it is recommended that the pad be soldered to the ground plane.