DA6240C.007

17 October, 2016

10 (13)

QFN 3x3x0.75 12ld PCB LAND PATTERN

Notes



I/O lands should be 0.2mm longer than QFN pads and extend the same 0.2mm outside package outline



exposed pad land size should be the same as QFN exposed pad size



solder resist opening should be 120

m…150m larger than the land size resulting in 60m…75m

clearance between copper land and solder resist