ADVANCED

SP8059

Rev 0.7e (05-17-05)

SP8059 Ten-Channel Photo detector IC

Copyright 2005 Sipex Corporation

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PIN ASSIGNMENTS

Pin #

Pin Name

Pin Function

1

A

Output of A channel

2

D

Output of D channel

3

Vcc

Supply voltage. Bypass to GND with ceramic capacitor 0.1uF

4

RF+

Output of RF+ channel. RF+ = 0.375 (A + B + C + D)

5

RF-

Output of RF- channel. RF- = -0.375 (A + B + C + D)

6

GND

Ground pin

7

B

Output of B channel

8

C

Output of C channel

9

H

Output of H channel

10

F

Output of F channel

11

Gain 2

Gain switch input.

12

Gain 0

Gain switch input.

13

Gain 1

Gain switch input.

14

Vref

Reference voltage. Bypass to GND with ceramic capacitor 0.1uF

15

G

Output of G channel

16

E

Output of E channel

BOARD LAYOUT AND GROUNDING

To obtain the best performance from the SP8059, a printed circuit board with ground plane is

required. Ground pins (pin #6) should be connected to the ground plane. High quality, low series

resistance ceramic 0.1uF bypass capacitors should be used at the Vcc and Vref pins (pins #3 and

#14). These capacitors must be located as close to the pins as possible. The traces connecting

the pins to the ground plane, Vcc, Vref, and bypassing capacitors must be kept short and should

be made as wide as possible.