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FFM302CG Datenblatt(PDF) 1 Page - Shenzhen Foster Semiconductor Co., Ltd.

Teilenummer FFM302CG
Bauteilbeschribung  Chip Silicon Rectifier
PDF  3 Pages
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Hersteller  FOSTER [Shenzhen Foster Semiconductor Co., Ltd.]
Direct Link  http://www.first-semi.com
Logo FOSTER - Shenzhen Foster Semiconductor Co., Ltd.

FFM302CG Datenblatt(HTML) 1 Page - Shenzhen Foster Semiconductor Co., Ltd.

  FFM302CG Datasheet HTML 1Page - Shenzhen Foster Semiconductor Co., Ltd. FFM302CG Datasheet HTML 2Page - Shenzhen Foster Semiconductor Co., Ltd. FFM302CG Datasheet HTML 3Page - Shenzhen Foster Semiconductor Co., Ltd.  
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1.Cathode
2. Anode
PARAMETER
CONDITIONS
Forward rectified current
Forward surge current
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
Ambient temperature = 55 C
o
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
f=1MHz and applied 4V DC reverse voltage
Symbol
MIN.
TYP.
MAX.
UNIT
I
O
I
FSM
I
R
R
θJA
C
J
T
STG
A
A
μA
OC/W
OC
pF
3.0
90
5.0
+150
-55
45
V
= V
T = 25 C
R
RRM
J
O
V
= V
T = 100 C
R
RRM
J
O
Junction to ambient
40
100
FFM301CG
FFM302CG
FFM303CG
50
100
200
35
70
140
SYMBOLS
V
RRM
(V)
V
RMS
V
R
(V)
(V)
*1
*2
*3
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I =3.0A
F
*5 Maximum Reverse recovery time, note 1
V
F
(V)
*4
FFM304CG
FFM305CG
400
600
280
420
1.30
-55 to +150
FFM306CG
FFM307CG
800
1000
560
700
T
RR
(nS)
*5
150
250
500
50
100
200
400
600
800
1000
(C)
O
Operating
temperature
T,
J
Note 1. Reverse recovery time test condition, I =0.5A, I =1.0A, I
=0.25A
FRRR
FFM301CG THRU FFM307CG
Chip Silicon Rectifier
3.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Package outline
Dimensions in inches and (millimeters)
Batch process design, excellent power dissipation offers
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
•
• High current capability.
• Fast switching for high efficiency.
• High surge current capability.
• Glass passivated chip junction.
• Lead- free parts meet RoHS requirments.
• Epoxy: UL94-V0 rated frame retardant
• Case: Molded plastic, DO-214AB / SMC
• Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
• Polarity: lndicated by cathode band
• Mounting Position: Any
• Weight: Approximated 0.25 gram
Mechanical data
Maximum ratings (AT T =25
A
oC unless otherwise noted)
DO-214AB(SMC)
@ 2018 Copyright By American First Semiconductor
REV:1.0
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