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MPC885ZP80 Datenblatt(PDF) 88 Page - Freescale Semiconductor, Inc |
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MPC885ZP80 Datenblatt(HTML) 88 Page - Freescale Semiconductor, Inc |
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88 / 92 page ![]() MPC885/MPC880 Hardware Specifications, Rev. 3 88 Freescale Semiconductor Mechanical Data and Ordering Information 16.2 Mechanical Dimensions of the PBGA Package Figure 77 shows the mechanical dimensions of the PBGA package. Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994. 3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. 4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. NOTES: |
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