INMP621

HANDLING INSTRUCTIONS

PICK AND PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the

MEMS microphone structure as follows:

•

Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the

pickup tool can make contact with any part of the lid surface.

•

Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.

Do not pull air out of or blow air into the microphone port.

•

Do not use excessive force to place the microphone on the PCB.

REFLOW SOLDER

For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to

attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in

Figure 2 and Table 4.

BOARD WASH

When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or

ultrasonic cleaning.

OUTLINE DIMENSIONS

Figure 20. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]

4 mm × 3 mm Body

Dimensions shown in millimeters

1.50

2.80

BOTTOM VIEW

TOP VIEW

SIDE VIEW

REFERENCE

CORNER

4.10

4.00

3.90

3.10

3.00

2.90

1

2

3

4

5

0.90

2.48

REF

0.72 REF

3.54 REF

1.05 REF

2.05

3.80

0.70

0.30 REF

0.25 DIA.

(THRU HOLE)

1.10 DIA.

1.70 DIA.

0.95 REF

0.35

0.35

0.30 REF

0.30 REF

1.10

1.00

0.90

0.24 REF

(Pins 1, 2, 4, 5)

0.30 REF

PIN 1

Page 18 of 20

Document Number: DS-INMP621-00

Revision: 1.0

Rev Date: 02/06/2014