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SC32300A/B.EVB Datenblatt(PDF) 11 Page - Semtech Corporation

Teilenummer SC32300A/B.EVB
Bauteilbeschribung  Synchronous Power MOSFET Driver With Integrated 3.3V LDO
PDF  18 Pages
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Hersteller  SEMTECH [Semtech Corporation]
Direct Link  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

SC32300A/B.EVB Datenblatt(HTML) 11 Page - Semtech Corporation

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SC32300B
11
FCCM/Diode Emulation Mode Operation
There are two operating modes which can be configured
with the FCCM pin of the SC32300B. When the FCCM pin
is floated or tied to a logic high signal (e.g. VDD), the drive
signal DL is always complementary to DH. This is called
forced continuous conduction mode (FCCM) operation.
If the FCCM pin is grounded, a zero-crossing circuit is
activated in the SC32300B. The DL output is turned to low
when the current in the external low-side MOSFET reaches
zero. In other words, the external low-side MOSFET acts
like a diode. This operation mode is thus called diode
emulation mode. The benefit of this diode emulation
mode is to reduce conduction losses at light load for high
efficiency.
SmartdriveTM
For each DH drive pulse, the SC32300B initially turns on
the high-side MOSFET with a weak driver, allowing a
softer, smooth turnoff of the low-side MOSFET. Once the
low-side MOSFET is turned off and the LX pin voltage has
risen about 2.5V above ground, the SC32300B switches
to a much stronger driver to complete the turn-on of the
high-side MOSFET at a more rapid rate. This technique
reduces the voltage ringing for the switching node, which
relieves the need for a snubber or a gate resistor.
Bootstrap Capacitor
The SC32300B integrates the bootstrap switch. Only an
external bootstrap capacitor connected between the BST
pin and the LX pin is needed for a complete bootstrap
circuit.Thebootstrapcapacitor,whichischargedfromVDD
during the on time of the low-side MOSFET, provides the
energy to turn on the high-side MOSFET. The capacitance
for the bootstrap capacitor is mainly determined by the
gate charge Q
g of the high-side MOSFET. The equation
below gives a first order estimate:
C
b = Qg / ΔVb
Where ΔV
b is the allowable voltage drop of the drive
voltage for the high-side MOSFET. In a real application,
considering the capacitance tolerance, Q
g variation,
leakage current of the BST pin etc., a capacitor with two
times the calculated value is a good starting point. A
ceramic capacitor of X5R or X7R, or equivalent material,
should be used.
VLDO Decoupling Capacitor
The VLDO pin is the 3.3V LDO output pin. This 3.3V LDO
can be used as the bias for a microcontroller or any other
digital controller which requires quite, accurate 3.3V
bias on the system board. A high frequency decoupling
capacitor with low ESR and low ESL should be put from
the VLDO pin to the GND pin with minimum trace length.
A typical value of 2.2µF, 6.3V rating, X5R or X7R ceramic
capacitor is recommended.
VDD Decoupling Capacitor
The VDD is the input bias for the low-side driver and the
internal control circuitry. This pin is also used for the VDD
UVLO check. A high frequency decoupling capacitor
with low ESR and low ESL should be put from the VDD
pin to the GND pin with minimum trace length. A typical
value of 2.2µF, 10V rating, X5R or X7R ceramic capacitor is
recommended.
Power Dissipation
The power dissipation in this driver consists of two main
components: the power loss for turning on and off the
external MOSFETs, and the power loss in the internal LDO
(if used). The below equation can be used to estimate the
total power dissipation in the driver:
P
d = VDD fs (Qgh + Qgl) + (VDD - 3.3) IL
Where:
f
s is the switching frequency
Q
gh is the total gate charge of the high-side MOSFET
Q
gl is the total gate charge of the low-side MOSFET
I
L is the external load connected to the VLDO pin
To ensure proper operation and long-term reliability,
the power dissipation should be examined in the real
application to make sure the junction temperature will
not go beyond 125OC. Multiple vias should be used to
connect the thermal pad underneath the driver package
to the ground plane on the system board for good thermal
Application Information (Continued)



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