STM32WB55CC datasheet(153/165 Pages) STMICROELECTRONICS

Teilenummer	STM32WB55CC

Bauteilbeschribung	Multiprotocol wireless 32-bit MCU Arm

PDF	165 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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153 / 165 page

DS11929 Rev 3

153/165

STM32WB55xx

Package information

160

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

7.1

WLCSP100 package information

For information on WLCSP100 package contact your local STMicroelectronics sales office.

7.2

VFQFPN68 package information

Figure 33. VFQFPN68, 8 x 8 mm, 0.4 mm pitch, very thin fine pitch quad flat

package outline

1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed

version. Very thin profile: 0.80 < A ≤ 1.00 mm.

2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other

feature of package body. Exact shape and size of this feature is optional.

STM32WB55CC Datenblatt(PDF) 153 Page - STMicroelectronics