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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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STM32WB55CC Datenblatt(PDF) 26 Page - STMicroelectronics |
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STM32WB55CC Datenblatt(HTML) 26 Page - STMicroelectronics |
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26 / 165 page  Functional overview STM32WB55xx 26/165 DS11929 Rev 3 During power up/ down, the following power sequence requirements must be respected: • When VDD is below 1 V, other power supplies (VDDA, VDDUSB, VLCD), must remain below VDD + 300 mV • When VDD is above 1 V, all power supplies are independent. Figure 5. Power-up/down sequence 1. VDDX refers to any power supply among VDDA, VDDUSB, VLCD. During the power down phase, VDD can temporarily become lower than other supplies only if the energy provided to the MCU remains below 1 mJ. This allows the external decoupling capacitors to be discharged with different time constants during the power down transient phase. Note: VDD, VDDRF and VDDSMPS must be wired together, so they follow the same voltage sequence. |
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