STM32WB55CC datasheet(158/165 Pages) STMICROELECTRONICS

158 / 165 page

Package information

STM32WB55xx

158/165

DS11929 Rev 3

7.4

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 22: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated

using the equation:

TJ max = TA max + (PD max x ΘJA)

where:

•

TA max is the maximum ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins:

•

PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Note:

When the SMPS is used, a portion of the power consumption is dissipated into the external

inductor, therefore reducing the chip power dissipation. This portion depends mainly on the

inductor ESR characteristics.

Note:

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the

chip power consumption.

Note:

RF characteristics (such as sensitivity, Tx power, consumption) are provided up to 85 °C.

7.4.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

7.4.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering

information scheme shown in Section 8.

Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and, to a specific maximum junction temperature.

Table 97. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFQFPN48 - 7 mm x 7 mm

°C/W

Thermal resistance junction-ambient

VFQFPN68 - 8 mm x 8 mm

Thermal resistance junction-ambient

WLCSP100 - 0.4 mm pitch

STM32WB55CC Datenblatt(PDF) 158 Page - STMicroelectronics

STM32WB55CC Datenblatt(HTML) 158 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datenblatt Download

Link URL