© 2001 IXYS All rights reserved

TO-247 SMD*

G

E

C (TAB)

C (TAB)

G

C

TO-247 AD

Symbol

Test Conditions

Maximum Ratings

V

CES

T

J

= 25°C to 150°C

300

V

V

CGR

T

J

= 25°C to 150°C; R

300

V

V

GES

Continuous

±20

V

V

GEM

Transient

±30

V

I

C25

T

C

= 25°C

60

A

I

C90

T

C

= 90°C

40

A

I

CM

T

C

= 25°C, 1 ms

160

A

SSOA

V

I

A

(RBSOA)

Clamped inductive load, L = 30

µH

@ 0.8 V

CES

P

C

T

C

= 25°C

200

W

T

J

-55 ... +150

°C

T

JM

150

°C

T

stg

-55 ... +150

°C

Maximum lead temperature for soldering

300

°C

1.6 mm (0.062 in.) from case for 10 s

Maximum Tab temperature for soldering SMD devices for 10 s 260

°C

M

d

Mounting torque (M3)

1.13/10 Nm/lb.in.

Weight

TO-247 AD

6

g

TO-247 SMD

4

g

97506E(11/01)

Symbol

Test Conditions

Characteristic Values

(T

min.

typ.

max.

BV

CES

I

C

= 250

µA, V

300

V

V

GE(th)

I

C

= 250

µA, V

2.5

5

V

I

CES

V

CE

= 0.8 V

CES

T

200

µA

V

GE

= 0 V

T

1

mA

I

GES

V

CE

= 0 V, V

±100

nA

V

CE(sat)

I

C

= I

40N30

1.8V

40N30A

2.1

V

40N30B

2.4

V

Features

• Internationalstandardpackages

JEDEC TO-247 AD and surface

mountable TO-247 SMD

• Highcurrenthandlingcapability

process

• MOS Gate turn-on

- drive simplicity

Applications

• AC motor speed control

• DC servo and robot drives

• DC choppers

• Uninterruptible power supplies (UPS)

• Switched-mode and resonant-mode

power supplies

Advantages

• High power density

• Suitableforsurfacemounting

• Switching speed for high frequency

applications

• Easy to mount with 1 screw,

(isolated mounting screw hole)

V

CES

I

C25

V

CE(sat)

t

fi

IXGH 40N30/S

300 V 60 A

1.8 V

220ns

IXGH 40N30A/S

300 V 60 A

2.1 V

120ns

IXGH 40N30B/S

300 V 60 A

2.4 V

75 ns

E

G = Gate,

C = Collector,

E = Emitter,

TAB = Collector

* Add suffix letter "S" for surface mountable

package