SN74LVC2GU04DBVT datasheet(1/12 Pages) TI

Teilenummer	SN74LVC2GU04DBVT

Bauteilbeschribung	DUAL INVERTER GATE

PDF	12 Pages

Scroll/Zoom	100%

Hersteller	TI [Texas Instruments]

Direct Link	http://www.ti.com

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SN74LVC2GU04

DUAL INVERTER GATE

SCES197J – APRIL 1999 – REVISED FEBRUARY 2003

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Available in the Texas Instruments

NanoStar

 and NanoFree Packages

D Supports 5-V VCC Operation

D Inputs Accept Voltages to 5.5 V

D Max tpd of 3.7 ns at 3.3 V

D Low Power Consumption, 10-µA Max ICC

D ±24-mA Output Drive at 3.3 V

D Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

D Typical VOHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA = 25°C

D Unbuffered Outputs

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

description/ordering information

This dual inverter is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 – WCSP (DSBGA)

0.17-mm Small Bump – YEA

SN74LVC2GU04YEAR

NanoFree

 – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

SN74LVC2GU04YZAR

CD

NanoStar

 – WCSP (DSBGA)

0.23-mm Large Bump – YEP

Reel of 3000

SN74LVC2GU04YEPR

_ _ _CD_

–40

°C to 85°C

NanoFree

 – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SN74LVC2GU04YZPR

SOT (SOT 23)

DBV

Reel of 3000

SN74LVC2GU04DBVR

CU4

SOT (SOT-23) – DBV

Reel of 250

SN74LVC2GU04DBVT

CU4_

SOT (SC 70)

DCK

Reel of 3000

SN74LVC2GU04DCKR

CD

SOT (SC-70) – DCK

Reel of 3000

SN74LVC2GU04DCKT

CD_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site.

Copyright

 2003, Texas Instruments Incorporated

NanoStar and NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

1A

GND

2A

1Y

VCC

2Y

3

2

1

4

5

6

2A

GND

1A

2Y

VCC

1Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

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